Description
12W/M.K GPU CPU Thermal Paste LED IC Amplifier Chipset Heatsink Cooling Silicone Grease Compound
Feature
1.Thermal Conductivity: 12W/M.K;
2.Thermal Impedance: <0.01°C*m²/W;
3.Electrically Conductive: No;
4.Harmless;
5.Content: 2g/4g/8g;
6.Together with: Scraper;
7.Certificate: SGS;
Knowledge
Thermal paste may have some names, such as “thermal compound”,”TIM”
(Thermal Interface Material), or “thermal grease”. but they all to be used to
help keep your chip cool by ensuring that heat passes from the CPU to the
cooler in an efficient manner.
Thermal paste consists of a polymerizable liquid matrix and large volume
fractions of electrically insulating,but thermally conductive filler.Typical matrix
materials are epoxies, silicones (silicone grease), urethanes,and acrylates;
solvent-based systems, hot-melt adhesives, and pressure-sensitive adhesive
tapes are also available.Aluminum oxide, boron nitride, zinc oxide,and increasingly
aluminum nitride are used as fillers for these types of adhesives. The filler loading
can be as high as 70–80% by mass, and raises the thermal conductivity of the base
matrix from 0.17~0.3 W/(m·K) up to about 4 W/(m·K).
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